The new HOTFLOW series from ERSA once again raises the bar when it comes to the reflow process. The design of the new ovens focused on optimising heat transfer and reducing maintenance time while increasing machine uptime and productivity.

The ERSA HOTFLOW 4 series ovens come in any configuration to suit your process. From the 4/8 with 8 heating zones to the 4/26 with its 26 heating zones. All HOTFLOW models share the same features:

  • Outstanding thermal performance with excellent power balance
  • Multi-level controlled cooling
  • Multi-level process gas cleaning (flux management)
  • Low Nitrogen consumption
  • Multi lane conveyor system

The popular ERSA HOTFLOW 3 series ovens are of course still available. The 3/14 and 3/20 ovens are the proven workhorses of the reflow family and there are utilised in many 24/7 operations. Features include:

  • Excellent heat transfer with the most varied boards
  • Multi-level controlled cooling
  • Multi-level process gas cleaning (flux management)
  • “On the Fly” maintenance for increased machine uptime
  • Multi lane conveyor system

The ERSA HOTFLOW 3/14e and 3/20e ovens are energy efficient ovens with excellent thermal performance and optimised for the Pb-free process. They are economically priced and give maximum value for return on investment.  Features include:

  • Optimised heat transfer, minimised delta T
  • Internal cooling
  • Automatic chain lubrication
  • Automatic low mass centre support
  • Multi lane conveyor system available

The New X-Reflow306 LF-AC is a bench top, convection batch oven which is also nitrogen ready. It is designed for Lead Free soldering. It has high performance, low cost, is well thought out and is designed for prototyping, laboratory testing, heat-resistance testing and low volume production. The X-Reflow306 LF-AC is the only oven on the market which meets the new test procedures for PCB laminate manufacture. The oven can simulate 6 or 8 (changeable) reflow cycles with accelerated cooling between cycles to room temperature with minimum operator intervention.

Some key features of the X-Reflow306 LF-AC are:

  • Large backlit LCD display for ease of operation
  • Full convection heating with independent control of front and rear heaters
  • Large inspection window allows monitoring of the reflow process
  • Microprocessor based control uses closed loop monitoring to ensure repeatability of the temperature profiles
  • PC interface allows Windows based control of programming and operation as well as back up of all information and system upgrades
  • High Operating Temperature of 350 C
  • Small desktop size, weighs only 43kg
  • 250 program capacity in memory
  • Nitrogen port
  • Accelerated, advanced cooling system
  • Intelligent and unique fume extraction management

Technical Specifications


X-Reflow306 LF-AC

Reflow area

305x305x45 mm

Temperature range

70C to 350C

Temperature Zones

Preheat1, Preheat2, Soak, Reflow, Cooling - Total of 5 (five) zones


2 Heaters (Front and Rear) 2.4kW programmed independently

Max. PCB size

12"x12" (305x305 mm)

Supply Requirements

21 amps, 230V 50/60 Hz (Max power consumption: 5 kW)

Cooling Cycle

Last (Fifth) Zone

Monitoring Window Size

280 x 280 mm

Nitrogen Connection

Standard Connector. Nitrogen pressure:1/2-1bar (7-14.5 psi)


L=480mm x W=711mm x H=200mm

Weight (unpacked)

40 kg

Computer profile control

Allows pre-programming, storage and recall of up to 250 programs

Communication with PC

RS485 port (XKAR X485-USB converter required to connect to PC USB port)